| Abstract |
The present project deals with new digital solutions to determine and describe the material properties of polymer composites in printed circuit boards (PCBs), substrate like PCBs and Integrated Circuit (IC) substrates. The project objectives are defined within the given framework of the ongoing development in the microelectronics industry. Europe is currently undertaking massive efforts to establish an independent microelectronics ecosystem. These efforts are backed by all the major European Union strategy initiatives, such as the European Chips Act or the IPCEI – Important Project of Common European Interest Microelectronics II or indirectly by the Green Deal or Digital Europe. The first visible results are major investments by global industry leaders as for example by Taiwan Semiconductor Chip Manufacturing (TSCM) joining forces with the European based companies Bosch, NXP and Nexperia to set up a European Semiconductor Chip Manufacturing (ESCM) site in Germany or by Intel who announced investments of 33 billion € on semiconductor manufacturing in Europe. In addition, also the companies in the EBS value chain invest in manufacturing and research in Europe. One example is the project company partner AT&S who is currently building a new R&D center in Austria to work on substrate and packaging solutions for the global semiconductor industry. |
